Our story
Building strategic packaging capability for a new semiconductor era
Stratachip is a semiconductor venture focused on enabling advanced packaging capability in India. The company is being shaped to support the growing need for trusted, scalable and future-ready semiconductor packaging infrastructure aligned with national priorities and global supply chain diversification.
With a strong focus on technology access, execution discipline, and long-term manufacturing capability, Stratachip is positioned to contribute to India’s semiconductor journey with an emphasis on advanced packaging and high-value downstream capability creation.
Our Vision
To help establish India as a credible destination for advanced semiconductor packaging by building capability, enabling technology transfer, and supporting the development of a trusted domestic ecosystem.
To create a high-value semiconductor packaging platform in India that combines global technology access with disciplined local execution.
Our Mission
our Leadership
Driven by expertise. Defined by precision. Focused on the future.
Dr. P.R. Chidambaram
Chairman, StrataChip Group
Dr. P.R. “Chidi” Chidambaram is a highly accomplished semiconductor leader with 20+ years of experience in advanced process technology and foundry engineering. He currently serves in a leadership role at Qualcomm where he drives process innovation and large-scale semiconductor production strategies.
He has played a key role in developing and scaling advanced semiconductor nodes including 28nm, 20nm and 14nm technologies, contributing significantly to high-performance chip manufacturing.
VP, Manufacturing
Mr. Raghav Gupta
A technology-driven manufacturing leader, specialising in advanced materials, defence engineering and scalable manufacturing systems.
With academic credentials from Delhi Technological University (DTU) and the Indian Institute of Management Ahmedabad (IIM-A), he combines strong engineering expertise with strategic business leadership. His work focuses on bridging high-performance engineering with industrial-scale execution, making him a key driver of innovation and growth.
Major Deependra Sengar
SVP, Operations
He brings over 20+ years of experience in technology, data analytics and enterprise transformation. He has worked with global organizations, including leadership roles at Microsoft, driving innovation through AI, data-driven strategy and operational excellence.
With a strong foundation in both technical expertise and strategic execution he plays a key role in shaping StrataChip’s direction toward scalable, high-performance semiconductor solutions.
CEO, StrataChip Group
Dr. Choon Heung Lee
A veteran semiconductor leader with over 30 years of experience in advanced packaging and testing. Currently CEO of HPSP, he previously served as SVP at Intel and CEO & CTO of JCET/STATS ChipPAC, where he led a strong turnaround to profitability and built global leadership in semiconductor packaging.
Mr. Rajan Wadhawan
Advisor, StratacChip Group
An experienced business professional with a strong background in technology consulting, enterprise systems, and data-driven transformation. He has worked across multiple industries, contributing to large-scale system implementations and operational improvements.
With expertise in areas such as data migration, enterprise platforms and process optimization, he brings a practical and solution-oriented approach to business challenges, helping organizations improve efficiency and scalability.
Capabilities
StrataChip is building a phased capability roadmap in advanced semiconductor packaging, beginning with a strong foundation in quality assurance systems, operational planning, and a robust manufacturing execution framework. In the near term, the company is expanding into key capabilities including test and bump, memory packaging, system-in-package (SiP), wafer-on-wafer integration, fan-out wafer-level packaging (FOWLP), flip-chip, CSP/BGA packaging, and final test. Looking ahead, StrataChip aims to integrate digital traceability systems and MES-enabled manufacturing visibility, positioning itself for next-generation advanced packaging applications with scalable, high-reliability production infrastructure.
Built with
India in mind
India’s semiconductor ambition will require not only design and fabrication momentum, but also strong downstream packaging capability. Stratachip is being built with this long-term need in mind: to help strengthen domestic capability, support strategic sectors, and contribute to a more resilient electronics and semiconductor value chain.
Enabling the next layer of semiconductor value creation in India
Stratachip represents a long-term commitment to advanced manufacturing, technology access, and semiconductor capability building. We are laying the foundation for a future-facing packaging platform designed for relevance, resilience, and scale.
Contact Us
+91-9999884454
contact@stratachip.com
6-A, Sector 40/41, Ecotech-1, Greater Noida, UP, India, 201310